N211-099 TITLE: Photon-Counting Image Sensors Using Complementary Metal-oxide Semiconductor (CMOS) Foundry Processes
RT&L FOCUS AREA(S): Nuclear Modernization
TECHNOLOGY AREA(S): Electronics; Materials / Processes; Sensors
The technology within this topic is restricted under the International Traffic in Arms Regulation (ITAR), 22 CFR Parts 120-130, which controls the export and import of defense-related material and services, including export of sensitive technical data, or the Export Administration Regulation (EAR), 15 CFR Parts 730-774, which controls dual use items. Offerors must disclose any proposed use of foreign nationals (FNs), their country(ies) of origin, the type of visa or work permit possessed, and the statement of work (SOW) tasks intended for accomplishment by the FN(s) in accordance with section 3.5 of the Announcement. Offerors are advised foreign nationals proposed to perform on this topic may be restricted due to the technical data under US Export Control Laws.
OBJECTIVE: Develop a high-density, high-speed image sensor using Complementary metal-oxide semiconductor (CMOS) foundry processes that is capable of photon counting without deep cooling, and is also strategically radiation-hardened, for use in star trackers.
DESCRIPTION: The performance requirements for star trackers used in strategic navigation applications continue to become more stringent, necessitating continued innovation for image sensor technologies. Examples of existing research on photon-counting image sensors can be found in the Refs 1-5. In terms of idealities, these image sensors should be capable of high-speed (>1000 frames per second), low-noise (sub-electron) readout in a photon-counting mode without the need for deep cooling; have high-density (approx. 1 Ķm) pixel pitch; be radiation-hard at strategic levels; have low power consumption, and be able to be fabricated using CMOS foundry processes.
PHASE I: Perform a design and performance modeling study aimed at image sensors with improved performance for strategic star trackers as compared to the current state of the art. Assess performance and environmental sensitivity of parameters including responsivity, speed, noise, and defective pixels; consider all aspects of fabrication; and justify the feasibility/practicality of the approach. A goal of quantum efficiency greater than 70% from 400 to 640 nm and read noise < 0.3 electrons RMS is desired. The Phase I Option, if exercised, will include the initial design specifications and capabilities description to build a prototype solution in Phase II.
PHASE II: Fabricate and characterize a small lot (up to a quantity of 3) of prototype image sensors. Characterization using EMVA1288 standard, shall comprise various parameters including responsivity, speed, noise, and defective pixels. The prototypes shall be delivered by the end of Phase II.
PHASE III DUAL USE APPLICATIONS: Continue development to lead to productization of image sensors suitable for star trackers. While this technology is aimed at military/strategic applications, image sensors are heavily used in numerous other applications. An image sensor that can meet the stringent performance requirements of strategic instrumentation is likely to bring value to many existing commercial applications. Commercial applications for low light imaging applications include spectroscopy, optical scattering, and quantum communications.
KEYWORDS: image sensor; star tracker; navigation, Complementary metal-oxide semiconductor; foundry; radiation-hard
** TOPIC NOTICE **
The Navy Topic above is an "unofficial" copy from the overall DoD 21.1 SBIR BAA. Please see the official DoD Topic website at rt.cto.mil/rtl-small-business-resources/sbir-sttr/ for any updates.
The DoD issued its 21.1 SBIR BAA pre-release on December 8, 2020, which opens to receive proposals on January 14, 2021, and closes February 18, 2021 at 12:00 p.m. ET.
Direct Contact with Topic Authors: During the pre-release period (Dec 8, 2020 to January 13, 2021) proposing firms have an opportunity to directly contact the Technical Point of Contact (TPOC) to ask technical questions about the specific BAA topic. Once DoD begins accepting proposals on January 14, 2021 no further direct contact between proposers and topic authors is allowed unless the Topic Author is responding to a question submitted during the Pre-release period.
SITIS Q&A System: After the pre-release period, proposers may submit written questions through SITIS (SBIR/STTR Interactive Topic Information System) at www.dodsbirsttr.mil/topics-app/, login and follow instructions. In SITIS, the questioner and respondent remain anonymous but all questions and answers are posted for general viewing. Topic Q&A will close to new questions on February 4, 2021 at 12:00 p.m. ET
Note: Questions should be limited to specific information related to improving the understanding of a particular topicís requirements. Proposing firms may not ask for advice or guidance on solution approach and you may not submit additional material to the topic author. If information provided during an exchange with the topic author is deemed necessary for proposal preparation, that information will be made available to all parties through SITIS. After the pre-release period, questions must be asked through the SITIS on-line system.
Topics Search Engine: Visit the DoD Topic Search Tool at www.dodsbirsttr.mil/topics-app/ to find topics by keyword across all DoD Components participating in this BAA.