All Fiber-based Ultrashort Chirped Pulse Amplification Laser Operating at 2um Wavelengths Based on Thulium Doped Germanate Active Fibers Navy SBIR FY2010.3 Sol No.: Navy SBIR FY2010.3 Topic No.: N103-210 Topic Title: All Fiber-based Ultrashort Chirped Pulse Amplification Laser Operating at 2um Wavelengths Based on Thulium Doped Germanate Active Fibers Proposal No.: N103-210-0216 Firm: NP Photonics, Inc. UA Science and Technology Park 9030 S. Rita Road, Suite #120 Tucson, Arizona 85747-9108 Contact: Arturo Chavez-Pirson Phone: (520) 799-7438 Web Site: www.npphotonics.com Abstract: NP Photonics proposes to develop an all fiber-based ultrashort fiber laser system capable of generating high average power (multi-watt), single mode beam (M2 < 2) with high peak power per pulse and ultrashort pulse width (< 1 ps). This type of laser has significant advantages in terms of reliability (no moving parts or alignment), room temperature operation, size, weight, and power efficiency compared to conventional solid state lasers. The active fiber in the laser is based on a highly efficient thulium doped germanate glass fiber which operates at 2 microns wavelengths. It represents the heart of the optical engine consisting of a mode-locked fiber laser and large mode area fiber amplifiers. This laser system is expected to have a major impact on many applications, such as, for example, infrared countermeasures (IRCM) where a suitable ultra-short pulse laser operating near 2�m is needed to generate mid-IR (3�m - 5�m) super-continuum in a nonlinear optical fiber. We will target an all-fiber based laser performance with energy per pulse of at least 5 microjoules, repetition rate of 1 - 10 kHz, and <1 ps pulse duration, with at least 90 percent of the pulse energy contained in 5 ps. Benefits: The proposed high energy ultrashort fiber laser system will offer benefits in diverse applications areas including metal hole drilling for efficient fuel injectors, delicate scribing and minimal material removal of next generation thin-film photovoltaics, micromachining of advanced 3D semiconductor architectures, maritime and aviation systems, medical, and homeland defense. Return