Thermoelectric Integrated Heat Exchanger for E-2D Advanced Hawkeye Navy SBIR FY2010.2 Sol No.: Navy SBIR FY2010.2 Topic No.: N102-114 Topic Title: Thermoelectric Integrated Heat Exchanger for E-2D Advanced Hawkeye Proposal No.: N102-114-1189 Firm: Advanced Cooling Technologies, Inc. 1046 New Holland Avenue Lancaster, Pennsylvania 17601-5688 Contact: Richard Bonner Phone: (717) 295-6061 Web Site: www.1-ACT.com Abstract: Advanced Cooling Technologies, Inc. (ACT) proposes an innovative heat exchanger integrated with thermoelectric devices to achieve 10-15 kW additional cooling capacity to the current Liquid Cooling System (LCS) aboard the E2-D Advanced Hawkeye. The proposed heat exchanger will reduce the cold side temperature of the LCS by 3-5�F and reject the waste heat to the hot side of the LCS using thermoelectric devices to pump heat against the thermal gradient. By raising the hot side temperature of the LCS, the ultimate heat sink (ram air heat exchanger) will be able to handle the additional heat load without size increase. The proposed heat exchanger will replace existing sections of LCS plumbing, providing a design that has minimal impact on size and pressure drop. Additional innovations in the heat exchanger design will improve efficiency and mechanical reliability by allowing direct convection heat transfer to remove heat from the hot side of the thermoelectric modules. ACT has secured the support for this project from Northrop Grumman Aerospace Systems, the manufacturer of the E-2D Hawkeye. Northrop Grumman will provide design requirements and guide the development efforts in the Phase I and II and eventually become an integrator of the technology in actual aircraft. Benefits: The proposed thermoelectric integrated heat exchanger could be used in various commercial and military applications where liquid-liquid heat exchange against the thermal gradient (refrigeration) is required. Specifically, applications requiring compact solutions, long term reliability, and essentially no maintenance will be best suited for the proposed technology. Additionally, innovations in integration, e.g. allowing direct convection heat removal from the hot side, provide system level efficiencies that are currently unattainable with large scale thermoelectric solutions. Lastly, the technology is easily scalable increasing the flexibility of potential application. Return