Digital Electronics Health Prognosis Navy SBIR FY2005.2 Sol No.: Navy SBIR FY2005.2 Topic No.: N05-093 Topic Title: Digital Electronics Health Prognosis Proposal No.: N052-093-0539 Firm: VEXTEC Corporation 750 Old Hickory Blvd, Building 2, Suite 270 Brentwood, Tennessee 37027 Contact: Robert Tryon Phone: (615) 372-0299 Web Site: www.vextec.com Abstract: Electronic digital circuit boards are composites of organic or inorganic materials with external and internal wiring designed to electrically interconnect and mechanically support all of the components and dissipate heat. Digital electronic circuit failure is ultimately a material failure at either the board, interconnect or component level. VEXTEC proposes to extend JSF prognosis to digital electronics using a physics of failure and material microstructural modeling approach. This project will consider digital circuit failure due to lead-free solder fatigue, board delamination, and individual component failure. The proposed project will develop an innovative, diagnostic/prognostic life prediction methodology for JSF application using currently planned onboard sensed data as modeling input. Phase I will show concept feasibility through a remote input output (RIO) circuit board prognosis demonstration. This system represents an excellent example for the prognosis need given there are ten RIOs at various locations on the JSF aircraft. These ten RIO's represent a system of like components exposed to different environments within the aircraft. Also sensors are currently available to measure temperatures and vibration at each of the ten locations. Benefits: Over 70% of all digital electronic failures are attributed to interconnect failure alone. The issue becomes even more significant transitioning from lead to lead-free interconnect materials. JSF prognosis of lead-free interconnect failure could save maintenance cost, minimize spares requirements and maximize fleet readiness. Return